Kuchuluka kwa bolodi lolimba | |
Chiwerengero cha zigawo: | 1-42 zigawo |
Zofunika: | FR4\high TG FR4\Lead free material\CEM1\CEM3\Aluminium\Metal core\PTFE\Rogers |
Kunenepa kwa Cu wosanjikiza: | 1-6 OZ |
Makulidwe a Cu wamkati: | 1-4OZ |
Malo ochulukira kwambiri: | 610 * 1100mm |
Makulidwe ochepa a board: | 2 zigawo 0.3mm (12mil) |
4 zigawo 0.4mm (16mil) | |
6 zigawo 0.8mm (32mil) | |
8 zigawo 1.0mm (40mil) | |
10 zigawo 1.1mm (44mil) | |
12 zigawo 1.3mm (52mil) | |
14 zigawo 1.5mm (59mil) | |
16 zigawo 1.6mm (63mil) | |
Kuchepera Kochepa: | 0.076mm (3mil) |
Malo Ochepa: | 0.076mm (3mil) |
Kuchepa kwa dzenje (dzenje lomaliza): | 0.2 mm |
Chigawo: | 10:01 |
Kubowola kukula: | 0.2-0.65 mm |
Kulekerera kubowola: | +\-0.05mm(2mil) |
Kulekerera kwa PTH: | Φ0.2-1.6mm +\-0.075mm (3mil) |
Φ1.6-6.3mm+\-0.1mm(4mil) | |
Kulekerera kwa NPTH: | Φ0.2-1.6mm +\-0.05mm(2mil) |
Φ1.6-6.3mm+\-0.05mm(2mil) | |
Malizitsani kulolerana kwa bolodi: | Makulidwe <0.8mm, kulolerana: +/-0.08mm |
0.8mm≤Kunenepa≤6.5mm,Kulekerera+/-10% | |
Mlatho wocheperako wa soldermask: | 0.076mm (3mil) |
Kupotoza ndi kupindika: | ≤0.75% Min0.5% |
Mtengo wa TG: | 130-215 ℃ |
Kulekerera kwa Impedans: | +/- 10%, Mphindi+/-5% |
Chithandizo cha Pamwamba: | HASL, LF HASL |
Kumiza Golide, Kung'anima Golide, Chala Chagolide | |
Siliva Womiza, Tini Yomiza, OSP | |
Kusankha Golide, makulidwe a Golide mpaka 3um (120u") | |
Carbon Print, Peelable S/M,ENEPIG | |
Mphamvu ya Aluminium board | |
Chiwerengero cha zigawo: | Single layer, double layers |
Kukula kwakukulu kwa bolodi: | 1500 * 600mm |
Makulidwe a board: | 0.5-3.0 mm |
Makulidwe a Copper: | 0.5-4oz |
Bowo laling'ono: | 0.8 mm |
M'lifupi mwake: | 0.1 mm |
Malo ochepa: | 0.12 mm |
Kuchepa kwapadi: | 10 micron |
Kumaliza pamwamba: | HASL, OSP, ENIG |
Kuumba: | CNC, kukhomerera, V-kudula |
Zida: | Universal Tester |
Flying Probe Open/Short Tester | |
Microscope yamphamvu kwambiri | |
Solderability Testing Kit | |
Peel Strength tester | |
High Volt Open & Short tester | |
Cross Section Molding Kit With Polisher | |
Mphamvu ya FPC | |
Masanjidwe: | 1-8 zigawo |
Makulidwe a board: | 0.05-0.5mm |
Makulidwe a Copper: | 0.5-3OZ |
Kuchepera Kochepa: | 0.075 mm |
Malo ochepa: | 0.075 mm |
Kukula kwa dzenje: | 0.2 mm |
Kutsika kwa dzenje la laser: | 0.075 mm |
Bowo locheperako: | 0.5 mm |
Kulekerera kwa Soldermask: | +\-0.5mm |
Kulekerera kocheperako kwa njira: | +\-0.5mm |
Kumaliza pamwamba: | HASL,LF HASL, Siliva Womiza, Golide Womiza, Golide Wonyezimira, OSP |
Kuumba: | Kukhomerera, Laser, Dulani |
Zida: | Universal Tester |
Flying Probe Open/Short Tester | |
Microscope yamphamvu kwambiri | |
Solderability Testing Kit | |
Peel Strength tester | |
High Volt Open & Short tester | |
Cross Section Molding Kit With Polisher | |
Kulimba & flex mphamvu | |
Masanjidwe: | 1-28 zigawo |
Mtundu wazinthu: | FR-4(High Tg, Halogen Free, High Frequency) |
PTFE, BT, Getek, Aluminium base, Copper base, KB, Nanya, Shengyi, ITEQ, ILM, Isola, Nelco, Rogers, Arlon | |
Makulidwe a board: | 6-240mil / 0.15-6.0mm |
Makulidwe a Copper: | 210um (6oz) kwa wosanjikiza wamkati 210um (6oz) kwa wosanjikiza wakunja |
Min mechanical drill size: | 0.2mm/0.08” |
Chigawo: | 2:01 |
Makulidwe apamwamba kwambiri: | Sigle mbali kapena iwiri mbali: 500mm * 1200mm |
Magawo angapo: 508mm X 610mm (20″ X 24″) | |
Mzere wocheperako/danga: | 0.076mm / 0.076mm (0.003″ / 0.003″) / 3mil/3mil |
Kudzera mtundu wa dzenje: | Wakhungu / Wokwiriridwa / Wotsekera(VOP, VIP…) |
HDI / Microvia: | INDE |
Kumaliza pamwamba: | HASL, LF HASL |
Kumiza Golide, Kung'anima Golide, Chala Chagolide | |
Siliva Womiza, Tini Yomiza, OSP | |
Kusankha Golide, makulidwe a Golide mpaka 3um (120u") | |
Carbon Print, Peelable S/M,ENEPIG | |
Kuumba: | CNC, kukhomerera, V-kudula |
Zida: | Universal Tester |
Flying Probe Open/Short Tester | |
Microscope yamphamvu kwambiri | |
Solderability Testing Kit | |
Peel Strength tester | |
High Volt Open & Short tester | |
Cross Section Molding Kit With Polisher |
Nthawi yotumiza: Sep-05-2022